| » Wafer Bumping |
IC Interconnect® is a US based company which provides contract wafer bumping services to the electronics industry. The core technologies at ICI include: electroless nickel/gold under-bump-metallurgy (UBM), stencil printing of solder paste (lead based and lead free), and 100% inspection of bumped parts.
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»Electroless nickel/gold under-bump-metallurgy (UBM)
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»Stencil printing of solder paste (lead based and lead free)
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»100% inspection of bumped parts
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