|
|
 Wafer Bumping
Wafer Bumping is an wafer level packaging technology which uses solder bumps to form the interconnect between the integrated circuit (IC) and the package. An under-bump-metallugy (UBM) of electroless nickel and gold is first plated directly onto the I/O pad of the IC to create a solderableservice and provide for a barrier toward electromigration. This process is followed by the deposition of solder onto each site and a thermal reflow to form a solder ball. This technology is often referred to in the industry as Flip Chip Bumping.
When you are ready to make the move to Flip Chip technology, Quik-Pak offers complete Prototype Assembly Services, including Wafer/Die Bumping, Die Placement, Solder Reflow, Underfill, Encapsulation and Substrate Ball Attach. Quik-Pak also provides substrate design and manufacturing services to deliver a complete turnkey Flip Chip solution.
Wafer Bumping Services
Wafer Bumping
IC Interconnect® is a US based company which provides contract wafer bumping services to the electronics industry. The core technologies at ICI include: electroless nickel/gold under-bump-metallurgy (UBM), stencil printing of solder paste (lead based and lead free), and 100% inspection of bumped parts.
Electroless nickel/gold
under-bump-metallurgy (UBM) |
Stencil printing of solder paste
(lead based and lead free) |
100% inspection of bumped parts |
|
|
|
|
|
