| Wafer Bumping is an wafer level packaging technology which uses solder bumps to form the interconnect between the integrated circuit (IC) and the package. An under-bump-metallugy (UBM) of electroless nickel and gold is first plated directly onto the I/O pad of the IC to create a solderableservice and provide for a barrier toward electromigration. This process is followed by the deposition of solder onto each site and a thermal reflow to form a solder ball. This technology is often referred to in the industry as: Flip Chip Bumping, Chip Scale Packaging (CSP), or Wafer Level Packaging.
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