About us Browse  By  Product/Service Resources Contact us News Home Browse By Company
Browse Products & Services
Back Grinding
Wafer Handling
Wafer Bumping
Dicing
Die Handling
Test
IC Assembly
IC Packages
MEMS Package & Solutions
Failure Analysis
Foundry
Package Marking
Package Flattening
 
TEST
TEST is described as the process of evaluating the functionality, performance, reliability, or manufacturability of an electronic integrated circuit. Testing may be done either on a semiconductor wafer or packaged part. Various tests are performed during prototyping, debug, characterization, qualification, pre-production, and production of the part.











 » Equipment  » Materials  » Services