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Description
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Purpose
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Steady State Temperature Humidity Bias Life Test (THB)
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To evaluate the reliability of non hermetic packages in humid environments.
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High Temperature Bias and Operating Life (HTOL)
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To determine the effects of bias conditions and temperature over time.
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High Temperature Storage Life (HTS)
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To determine the effect of time and temperature under storage conditions.
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Thermal Shock (TS)
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To determine the resistance of the part to sudden exposure to extreme temperatures.
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Temperature Cycle (TC)
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To determine the ability of the device to withstand mechanical stresses.
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Moisture Sensitivity Level (MSL)
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To determine the moisture sensitivity level of the packaged device.
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Preconditioning
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To simulate a typical industry multiple solder reflow operation prior to reliability testing.
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Auto Clave
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To evaluate the moisture resistance integrity of non-hermetic devices
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ESD Test
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To determine the susceptibility of a device to damage by electrostatic discharge.
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Latch-Up (LU)
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To determine the susceptibility of a device to latch-up.
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