| Description |
Purpose |
| Steady State Temperature Humidity Bias Life Test (THB) |
To evaluate the reliability of non hermetic packages in humid environments. |
| High Temperature Bias and Operating Life (HTOL) |
To determine the effects of bias conditions and temperature over time. |
| High Temperature Storage Life (HTS) |
To determine the effect of time and temperature under storage conditions. |
| Thermal Shock (TS) |
To determine the resistance of the part to sudden exposure to extreme temperatures. |
| Temperature Cycle (TC) |
To determine the ability of the device to withstand mechanical stresses. |
| Moisture Sensitivity Level (MSL) |
To determine the moisture sensitivity level of the packaged device. |
| Preconditioning |
To simulate a typical industry multiple solder reflow operation prior to reliability testing. |
| Auto Clave |
To evaluate the moisture resistance integrity of non-hermetic devices |
| ESD Test |
To determine the susceptibility of a device to damage by electrostatic discharge. |
| Latch-Up (LU) |
To determine the susceptibility of a device to latch-up. |
Test Services