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Quik-Pak, a division of GEL-PAK, offers open-cavity reconfiguration of plastic IC package types (any type or size) for convenient assembly of prototype semiconductor die.
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Quik-Pak offers full-service plastic IC packaging for low-volume and prototyping applications. Quik-Pak is a source for:
» Open-cavity reconfiguration of plastic IC packages
» Any size, lead count or style, including MLF, LPCC, TSOP or BGA
» Wafer dicing
» Quick-turn assembly in plastic or ceramic packages, gold or aluminum wire
» Marking and remarking
» All services available on a "quick-turn" basis
Quik-Pak was founded as Silicon Packaging Technology (SPT) in 1993 to serve the needs of design engineers looking for a faster method of packaging prototypes and design verification samples. In July 2000, SPT was acquired by GEL-PAK of Hayward, California. Quik-Pak's manufacturing sites are in San Diego, California (HQ) and Essex Junction, Vermont. Local sales representatives serve northern California, Texas and Europe.
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