MEMS – Microelectromechanical Systems.
MEMS devices range from 1 to Appx. 100 microns in diameter and are built on a silicon substrate. MEMS chips have a top layer of mechanical devices such as mirrors or fluid sensors. The sensors allow them to respond to pressure, temperature, or light. Devices have applications in the automotive industry ( air bags) Medical Industry , (pacemakers), optical industry, and more.
The device has electrical and mechanical make up. They have one or more moving components, with electricity entering into the operation in some fashion. The device is “glued” into a package, wire bonded and covered with epoxy. An opening or “window” is created to form a hermetic environment. The custom opening is a major factor in development.
Packages are critical to the device performance, as well as providing general device housing and protection. Custom packages are required in most cases. This can require specialized package development, analysis and Prototyping considerations.
|
