 MEMS Package & Solutions
MEMS – Microelectromechanical Systems
MEMS devices range from 1 to Appx. 100 microns in diameter and are built on a silicon substrate. MEMS chips have a top layer of mechanical devices such as mirrors or fluid sensors. The sensors allow them to respond to pressure, temperature, or light. Devices have applications in the automotive industry (air bags) Medical Industry, (pacemakers), optical industry, and more. The device has electrical and mechanical make up. They have one or more moving components, with electricity entering into the operation in some fashion. The device is “glued” into a package, wire bonded and covered with epoxy. An opening or “window” is created to form a hermetic environment. The custom opening is a major factor in development.
Packages are critical to the device performance, as well as providing general device housing and protection. Custom packages are required in most cases. This can require specialized package development, analysis and Prototyping considerations.
MEMS Assembly
Quik-Pak's unique assembly techniques provides the capability to assemble MEMS devices, including chemical, environmental and pressure sensors and other configurations requiring an air cavity. Our laser micromachining system allows the creation of custom packages and assemblies, with frames, lids and covers to protect your delicate devices.
MEMS Handling
Vacuum Release™ (VR Series) Trays
Gel-Pak’s patented VR Series provides a breakthrough in the handling of devices from small transistors and diodes to large IC’s and wafers. The surface of the tray features a proprietary GEL membrane that holds the device in place. Parts are released “on demand” by drawing a vacuum under the tray. Once the tray is in the release mode, removal of the device is accomplished with a vacuum pick-up tool. The hold/release mechanism is reversible and the tray is reusable. VR Series trays are ideal for automated device handling.
The VR technology offers many advantages over conventional packages
» Eliminates the need for large molded parts inventory
» Surface and edge protection
» Prevents edge chipping and chafing during shipping & handling
» Avoids accidental loss and spillage
» Eliminates die sticking in pockets and cavities
» Allows inspection of edges for damage and flaws
» Captures chip dust fragments and other particles
» Die edges are fully accessible for handling
» Multiple device size per part number
GEL-PAK’s proprietary membrane
holds devices firmly, yet gently, in place. |
A vacuum drawn beneath the membrane releases the device for vacuum or manual pick-up. |
VR Trays in a pick and place handler |
VR Series is available in both conductive and transparent materials and can be customized with grids, company logos, and color options for automated inspection or pick and place operations. Custom sizes and retentions are available upon request. |
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