| The
protective container (housing) for an integrated circuit (die).
Can include external leads to provide electrical access to the
internal component. Packages provide physical and chemical protection
of the circuits. Common package materials include Ceramic and
Plastic. IC Plastic packages are also available in OPEN-CAVITY
format. This "Open-Cavity" package is used for the
Assembly and test of new I.C.(Prototype) designs. It allows
for the I.C. design Engineer to test newdesigns ( FIB work,
die probing, more ) - in the same plastic package as intended
for Production.
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