At a Glance

» NEW! Same Day Service
» Plastic or Ceramic Package Assembly
» Ball or Wedge Bonding
» Gold or Aluminum Wire From 0.8 to 2.0 Mils
» Pitch to 65 microns
» Die Attach Using Conductive or Non-conductive Epoxy
» Ship As Open Cavity or With Removable Lids
» Reseal with Hysol (black encapsulation), clear encapsulation, or customer specific
    encapsulation
» Flattening and Marking Service Available Too.