| The
process of attaching an Integrated Circuit to a package. Common
Assembly methods include Wire-Bond and Flip Chip. Wire-bonding
involves making the electrical inter-connect between the chip
and the package leads by gold or aluminum wire. Basic methods
include thermal compression, ultrasonic and pulse. Equipment
used can be manual or automated bonders. Flip-Chip involves
bonding of chips with contact pads, face down, using solder
bump connections. |
