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FAILURE ANALYSIS & FIB SERVICE |
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Device level failure analysis entails the evaluation of micro electronic devices and integrated circuits that may have failed during design, manufacture, qualification, or service. MEFAS has over 30 full time engineers and technicians with backgrounds in microelectronics manufacturing and failure analysis. We are capable of solving a variety of single event failures as well as providing turnkey failure analysis and testing services for your corporation.
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MEFAS also provides ESD testing, Latch-up testing, and Reliability & Environmental testing services.
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FA Equipment Systems
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FA Common Techniques
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Real time x-ray
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Construction analysis
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Scanning acoustic microscopy
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Cross section service
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D/C characterization
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DPA
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Photon emission microscopy
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Decapsulation
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Micro probe
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Depassivation
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SEM/EDS
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Parallel lapping
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Reactive ion etch (RIE)
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Backside sample preparation
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Wire & solder ball strength test
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High resolution optical microscopy
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Laser scanning microscopy (LSM)
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Focused ion beam (FIB)
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FIB (focused ion beam) |
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IC designs can be rewired using a focused ion beam (FIB) system. In addition, we can provide precision cross sections, prepared TEM samples, and provide micro probe pads on your IC’S.
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