 Die-Handling Materials
Vacuum Release™ (VR Series) Trays
GEL-PAK’s patented VR Series provides a breakthrough in the handling of devices from small transistors and diodes to large IC’s and wafers. The surface of the tray features a proprietary GEL membrane that holds the device in place. Parts are released “on demand” by drawing a vacuum under the tray. Once the tray is in the release mode, removal of the device is accomplished with a vacuum pick-up tool. The hold/release mechanism is reversible and the tray is reusable. VR Series trays are ideal for automated device handling.
The VR technology offers many advantages over conventional packages
» Eliminates the need for large molded parts inventory
» Surface and edge protection
» Prevents edge chipping and chafing during shipping & handling
» Avoids accidental loss and spillage
» Eliminates die sticking in pockets and cavities
» Allows inspection of edges for damage and flaws
» Captures chip dust fragments and other particles
» Die edges are fully accessible for handling
» Multiple device size per part number
GEL-PAK’s proprietary membrane
holds devices firmly, yet gently, in place. |
A vacuum drawn beneath the membrane releases the device for vacuum or manual pick-up. |
VR Trays in a pick and place handler |
VR Series is available in both conductive and transparent materials and can be customized with grids, company logos, and color options for automated inspection or pick and place operations. Custom sizes and retentions are available upon request. |
Literature Downloads
» Gel-Pak Brochure (483k pdf)
 PDF files require the Adobe Acrobat Reader, a
free download from Adobe.
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