It is now possible to have your wafer diced, the die assembled in the Open Cavity IC Plastic Package of your choice, the units marked to your specifications, and the remaining die shipped back to you in a GEL-PAK carrier - all on a Quick-Turn basis. Dicing Support includes processing of 6" and 8" wafers.
Quick-Turn Wafer Sawing/Dicing services include:
» Expedite
Dicing
» Remove Good
Die
» Assemble Die
in Package of Your Choice
» Return Unassembled Die in a GEL-PAK carrier
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