One of the critical materials for wafer backgrinding is the protective film that holds and protects the wafer front side during the thinning process.

GEL-PAK offers film products that are used for critical backgrinding operations of wafer materials such as GaAs and InP.

WF film is used for front side protection during wafer thinning, especially for critical applications that require thinning below 8 mils. WF film improves the uniformity of the backgrinding process and protects the thinned wafer during handling. The low peel strength of the film makes it easy to remove from the wafer after the process is completed.