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Semiconductor wafers are routinely thinned prior to dicing to aid the sawing operation and to allow the final assembled package thickness to be minimized. For semiconductor devices required to operate at high power levels, wafer thinning improves the ability to dissipate heat by lowering the thermal resistance of die. As final thickness is decreased, the wafer progressively becomes less able to support its own weight and to resist the stresses generated by post backgrinding processes. Thus, it is important to reduce the damage caused by backgrinding.
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