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| GEL-Box |
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| » | No need for custom-molded containers for every device.
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| » | Ideal for small die and microelectronic components.
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| » | Cost effective device protection.
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| » Read More |
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| GEL-Tray |
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| » | Patented Gel technology
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| » | Customized for Automatic Pick & Place Applications
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| » | Selected by Leading Manufacturers - Intel, Micron, Motorola
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| » Read More |
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| GEL-Film |
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| » | Wafer Thinning
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| » | Planarization & polishing
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| » | Scribe & break
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| » Read More |
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| Gel-Pak TrayVac |
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| » | Self-contained units
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| » | Requires no hoses or batteries to operate
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| » | Lift up to 500 grams.
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| » Read More |
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| Open-Molded Plastic Packages (OmPP)™ |
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| » | Larger Die Paddle Area
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| » | Supports Larger Die and Ground Bonds Per Given Body Size
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| » | Custom Body Sizes and Lead Counts Available
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| » | Superior Bondability
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| » Read More |
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| Backgrinding and Dicing Services |
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| » | Backgrind wafers to as thin as 50µm
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| » | Dicing of all types of wafers and panels
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| » | Die sort and pick and place
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| » Read More |
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| Flip Chip |
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| » | Complete Flip Chip Solution
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| » | Advanced Assembly Services
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| » | Die Placement
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| » Read More |
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| Quick-Turn I.C. Prototype Assembly |
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| » | I.C. Prototypes Assembled in ANY I.C. Plastic Package
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| » | Same day Service
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| » | Ceramic Assembly, Wafer Sawing, & Marking too.
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| » Read More |
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• Delphon Announces Partnership with Neu Dynamics Corporation
• Quik-Pak Announces Open-molded Plastic Packages (OmPP)™
• Quik-Pak Announces Copper Wire Bonding
• Quik-Pak Presented at this Year’s TowerJazz Global Symposium Aerospace and Defense Day
• Gel-Pak Announces New East Coast Distributor
• Jeanne Beacham of Delphon Industries Receives Two Prestigious Awards
• Quik-Pak awarded Plaque by IMAPS
• Quik-Pak Expands Open-molded Plastic Package (OmPP)™ Product Family
• Gel-Pak Offers New Website Tool for Customers
• UltraTape Announces Sample Kits Available for Purchase through Website
Read Press Releases » |
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