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| GEL-Box |
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| » | No need for custom-molded containers for every device.
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| » | Ideal for small die and microelectronic components.
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| » | Cost effective device protection.
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| » Read More |
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| GEL-Tray |
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| » | Patented Gel technology
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| » | Customized for Automatic Pick & Place Applications
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| » | Selected by Leading Manufacturers - Intel, Micron, Motorola
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| GEL-Film |
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| » | Wafer Thinning
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| » | Planarization & polishing
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| » | Scribe & break
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| » Read More |
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| Gel-Pak TrayVac |
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| » | Self-contained units
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| » | Requires no hoses or batteries to operate
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| » | Lift up to 500 grams.
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| Open-Molded Plastic Packages (OmPP)™ |
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| » | Larger Die Paddle Area
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| » | Supports Larger Die and Ground Bonds Per Given Body Size
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| » | Custom Body Sizes and Lead Counts Available
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| » | Superior Bondability
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| Backgrinding and Dicing Services |
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| » | Backgrind wafers to as thin as 50µm
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| » | Dicing of all types of wafers and panels
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| » | Die sort and pick and place
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| » Read More |
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| Flip Chip |
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| » | Complete Flip Chip Solution
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| » | Advanced Assembly Services
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| » | Die Placement
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| » Read More |
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| Quick-Turn I.C. Prototype Assembly |
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| » | I.C. Prototypes Assembled in ANY I.C. Plastic Package
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| » | Same day Service
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| » | Ceramic Assembly, Wafer Sawing, & Marking too.
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| » Read More |
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3/1/2012 : Quik-Pak: The Need For The Open-molded Plastic Package
2/1/2012 : Delphon Industries Sells ProbeMax™ Product Line to International Test Solutions
1/2/2012 : Quik-Pak Executive Outlook: A perspective Look at 2012
12/15/2011 : Quik-Pak Announces Copper Wire Bonding
12/14/2011 : Quik-Pak Presented at this year’s Tower Jazz Global Symposium Aerospace and Defense Day
10/11/2001 : Jeanne Beacham of Delphon Industries Receives Two Prestigious Awards
9/27/2011 : Quik-Pak Awarded Plaque by IMAPS
8/30/2011 : Gel-Pak expands in Southern California
8/18/2011 : Product Spotlight: H-Mesh Gel-Pak VR Tray
6/1/2011 : Quik-Pak Expands Open-molded Plastic Package (OmPP) Product Family
5/3/2011 : Delphon Announces Partnership with Neu Dynamics Corporation
4/28/2011 : Gel-Pak announces new product GP-PortaVac
4/12/2011 : Quik-Pak Announces Open-molded Plastic Packages (OmPP)
3/3/2011 : Quik-Pak Offers Innovative Approach to Bumping Single Die
2/4/2011 : Quik-Pak Hosts IMAPS Event at San Diego Offices
Read Press Releases » |
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