 |
| GEL-Box |
|
| » | No need for custom-molded containers for every device.
|
|
|
| » | Ideal for small die and microelectronic components.
|
|
|
| » | Cost effective device protection.
|
|
|
| » Read More
|
|
| GEL-Tray |
|
| » | Patented Gel technology
|
|
|
| » | Customized for Automatic Pick & Place Applications
|
|
|
| » | Selected by Leading Manufacturers - Intel, Micron, Motorola
|
|
|
| » Read More
|
|
| GEL-Film |
|
| » | Wafer Thinning
|
|
|
| » | Planarization & polishing
|
|
|
| » | Scribe & break.
|
|
|
| » Read More
|
|
| Penvac |
|
| » | Self-contained units
|
|
|
| » | Requires no hoses or batteries to operate
|
|
|
| » | Lift up to 500 grams.
|
|
|
| » Read More
|
|
| Release Stations |
|
| » | Draw a vacuum under a GEL-PAK vacuum release tray
|
|
|
| » | Custom ordered for special sizes.
|
|
|
| » Read More
|
|
| SiGe120 |
|
| » | Leading NPN speed/power performance
|
|
|
| » | SIA 0.18um CMOS
|
|
|
| » | Advantages for OC-768
|
|
|
| » Read More
|
|
| Die level carrier tape |
|
| » | Die level carrier tape
|
|
|
| » | Class 10,000 clean room compatible
|
|
|
| » Read More
|
|
| New Freedom Wand Compact |
|
| » | cordless
|
|
|
| » | battery operated
|
|
|
| » | vacuum wand system.
|
|
|
| » Read More
|
|
| TestEdge |
|
| » | IC Test Development
|
|
|
| » | Characterization
|
|
|
| » | Production Support
|
|
|
| » | Data Manager.
|
|
|
| » Read More
|
|
|
|
|
 |
| Package Marking |
|
| » | Identical to a transferred molded devices
|
|
|
| » | Ideal for Customer Samples
|
|
|
| » | FAST!!
|
|
|
| » Read More
|
|
| Package Flattening |
|
| » | Identical to transfer molded devices
|
|
|
| » | Deliverable in as little as one day
|
|
|
| » | Flattened assembled units ideal for board fits.
|
|
|
| » Read More
|
|
| Open Cavity Packages |
|
| » | Patented technology transforms any plastic IC package
|
|
|
| » | Any lead count/size can be reconfigured
|
|
|
| » | Ideal for I.C. Prototype Assembly.
|
|
|
| » Read More
|
|
| Quick-Turn I.C. Prototype Assembly |
|
| » | I.C. Prototypes Assembled in ANY I.C. Plastic Package
|
|
|
| » | Same day Service
|
|
|
| » | Ceramic Assembly, Wafer Sawing, & Marking too.
|
|
|
| » |
|
|
|
| » Read More
|
|
| Device Level Failure Analysis |
|
| » | MEFAS provides turnkey failure analysis services for your corporation.
|
|
|
| » Read More
|
|
| Package Environmental Testing |
|
| » | Mefas provides turnkey environmental testing services for your corporation.
|
|
|
| » Read More
|
|
| Film Frames / Wafer Saw Frames |
|
| » | In Line Wafer Handling
|
|
|
| » | Wafer Back Grinding
|
|
|
| » | Wafer Dicing
|
|
|
| » | Wafer/Die Sort
|
|
|
| » Read More
|
|
|
|
|
|
 |
|
Icassemblypak.com
is pleased to welcome TestEdge, Inc.
TestEdge provides a
wide range of IC test services for digital,
mixed signal and RF components across all
of the major
ATE test equipment.
>>
Read More |
|
New 3M BD Carrier
Tape for High Volume Bare Die Applications
GEL-PAK is pleased to offer
a packaging solution for
your high volume bare die applications, the
3M 3000
BD Precision Carrier Tape.
>>
Read More |
|
|
|