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| GEL-Box |
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| » | No need for custom-molded containers for every device.
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| » | Ideal for small die and microelectronic components.
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| » | Cost effective device protection.
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| » Read More
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| GEL-Tray |
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| » | Patented Gel technology
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| » | Customized for Automatic Pick & Place Applications
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| » | Selected by Leading Manufacturers - Intel, Micron, Motorola
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| » Read More
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| GEL-Film |
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| » | Wafer Thinning
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| » | Planarization & polishing
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| » | Scribe & break.
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| Penvac |
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| » | Self-contained units
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| » | Requires no hoses or batteries to operate
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| » | Lift up to 500 grams.
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| » Read More
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| Release Stations |
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| » | Draw a vacuum under a GEL-PAK vacuum release tray
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| » | Custom ordered for special sizes.
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| » Read More
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| SiGe120 |
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| » | Leading NPN speed/power performance
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| » | SIA 0.18um CMOS
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| » | Advantages for OC-768
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| » Read More
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| Die level carrier tape |
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| » | Die level carrier tape
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| » | Class 10,000 clean room compatible
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| » Read More
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| New Freedom Wand Compact |
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| » | cordless
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| » | battery operated
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| » | vacuum wand system.
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| TestEdge |
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| » | IC Test Development
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| » | Characterization
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| » | Production Support
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| » | Data Manager.
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| » Read More
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| Package Marking |
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| » | Identical to a transferred molded devices
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| » | Ideal for Customer Samples
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| » | FAST!!
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| » Read More
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| Package Flattening |
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| » | Identical to transfer molded devices
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| » | Deliverable in as little as one day
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| » | Flattened assembled units ideal for board fits.
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| » Read More
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| Open Cavity Packages |
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| » | Patented technology transforms any plastic IC package
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| » | Any lead count/size can be reconfigured
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| » | Ideal for I.C. Prototype Assembly.
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| » Read More
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| Quick-Turn I.C. Prototype Assembly |
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| » | I.C. Prototypes Assembled in ANY I.C. Plastic Package
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| » | Same day Service
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| » | Ceramic Assembly, Wafer Sawing, & Marking too.
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| » |
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| Device Level Failure Analysis |
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| » | MEFAS provides turnkey failure analysis services for your corporation.
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| » Read More
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| Package Environmental Testing |
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| » | Mefas provides turnkey environmental testing services for your corporation.
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| » Read More
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| Film Frames / Wafer Saw Frames |
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| » | In Line Wafer Handling
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| » | Wafer Back Grinding
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| » | Wafer Dicing
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| » | Wafer/Die Sort
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| » Read More
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Icassemblypak.com
is pleased to welcome TestEdge, Inc.
TestEdge provides a
wide range of IC test services for digital,
mixed signal and RF components across all
of the major
ATE test equipment.
>>
Read More |
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New 3M BD Carrier
Tape for High Volume Bare Die Applications
GEL-PAK is pleased to offer
a packaging solution for
your high volume bare die applications, the
3M 3000
BD Precision Carrier Tape.
>>
Read More |
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